Ceramic vacuum chucks with two features:

1, absorb the workpiece and paint it on the vacuum sucker.
2, the workpiece is floated and applied to the air float platform and non-contact transfer system.
Application principle:
When the air flow is set to enter the ceramic (vacuum pressure is negative pressure), the workpiece can be adsorbed.
When the airflow is set to flow out of the ceramic (vacuum pressure is positive), the part may puff up or not come into contact with the ceramic.Ceramic vacuum chucks application:
For the photoelectric industry, it can be used as:
1. Pick up and put the chuck
2. Combination stage
3. Air exposure
4. Non-contact transfer stage

For the semiconductor industry it can be used as:

1, the wafer heating
2. Wafer transfer
3, wafer cutting
4. Dicing machine
5, laser cutting
6, wafer grinding
7, wafer cleaning

6 ", 8 ", 12 "regular sizes, available in round, square, oval or irregular shapes and sizes.
Ceramic vacuum chucks have many pores through ceramic sintering technology and are used in semiconductor vacuum chucks. It can be used as an air float platform for a wide range of applications in semiconductors, panels, laser processes and non-contact linear sliding.

The application principle of Ceramic vacuum chucks:

By applying positive and negative pressure gas to absorb or float workpieces, including wafers, glass, PET films or other thin objects, the air flow of negative vacuum pressure is set to enter the ceramic, the workpiece can be adsorbed, the air flow of positive semiconductor vacuum pressure is set to flow out of the ceramic, the part can blow up or not touch the ceramic.