Because of its position and importance in semiconductor equipment, advanced ceramic ring parts must meet the comprehensive performance requirements of semiconductor equipment for materials in mechanical mechanics, heat, dielectric, acid and alkali resistance and plasma corrosion, and high precision requirements, because ceramic rings in semiconductor equipment are usually closely around the wafer, and some even directly contact the wafer. Therefore, the control of metal ions and particles on its surface is extremely strict. In addition, because the production of ceramic rings for semiconductor devices involves original equipment manufacturer certification, it is a high-threshold industry for exclusivity.

Features of  alumina ceramic ring in semiconductor equipment

Purity:92%,95%,96%,99%,99.5%,99.7%,99.8%.
1. Good mechanical strength
2. Excellent electrical insulation
3. High-frequency loss
4. Good thermal conductivity
5. Heat,wear and corrosion resistance

Compressive Strength：2000Mpa/ 2091Mpa/ 2512Mpa/ 3500Mpa
Tensile Strength @ 25°C：140Mpa/150Mpa/200Mpa
Flexural Strength @ 25°C：331Mpa /276Mpa /324Mpa /500Mpa
Elastic Modulus：290GPa /331GPa /366GPa /380GPa
Maximum Working Temp：1650℃/1700℃
Thermal Conductivity @ 25°C    ：25 ,28.1, 30.7 ,33 (W/mK)